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客戶管理及技術服務

可靠性試驗和不良類型分析

可靠性測試和不良類型分析/ 可靠性測試相對應的規格，失效分析方法和類型

Reliability Test Method	Standard	Failure Mode	Failure Mechanism
THB HAST U-HAST MSL	JESD22-A101 JESD22-A110 JESD22-A118 J-STD-020	Open Short Leakage Functional Failure	Aluminum Metal Corrosion Electro Chemical Migration : Dendrite Growth, Conductive Anodic Filament Passivation Damaged Passivation Crack Delamination between layers in die(wafer) Delamination between package(mold compound) and die Delamination between package(mold compound) and internal layer Short by mobile ion caused by contamination or impurities Pad Cratering Whisker
TC PTC TS PC MSL	JESD22-A104 JESD22-A105 JESD22-A106 JESD22-A113 J-STD-020	Open Functional Failure	Bond Ball Lift Ball Neck Open Stitch Bonding Open Gold Wire Broken Solder Bump Open Passivation Damaged Passivation Crack Delamination between layers in die(wafer) Delamination between package(mold compound) and die Delamination between package(mold compound) and internal layer Pad Cratering Aluminum Slide Failure Whisker
HTOL HTS	JESD22-A103 JESD22-A108	Open Leakage Functional Failure	Bond ball lift by Kirkendall effect Passivation Damage Stress Migration Mobile Ion Charge Charge Loss Aluminum Metal Corrosion Oxide Breakdown
LTOL LTS	JESD22-A108 JESD22-A119	Leakage Functional Failure	Gate Oxide Breakdown
BL Drop BL TC Bending	JESD22-B111 IPC9701 JESD22-B113	Open	Solder Joint Crack
ESD HBM ESD MM ESD CDM Latch-up	(Commercial) JS-001 JESD22-A115 JS-002 JESD78 (Automotive) AEC-Q100-002 AEC-Q100-003 AEC-Q100-011 AEC-Q100-004	Open Short Leakage	Contact Spike Gate Oxide Break Poly Melting Metal Melting
TDDB	JP001	Leakage Functional Failure	Gate Oxide Breakdown Oxide Breakdown

Reliability Test Method	Standard	Failure Mode	Failure Mechanism
THB HAST U-HAST MSL	JESD22-A101 JESD22-A110 JESD22-A118 J-STD-020	Open Short Leakage Functional Failure	Aluminum Metal Corrosion Electro Chemical Migration : Dendrite Growth, Conductive Anodic Filament Passivation Damaged Passivation Crack Delamination between layers in die(wafer) Delamination between package(mold compound) and die Delamination between package(mold compound) and internal layer Short by mobile ion caused by contamination or impurities Pad Cratering Whisker
TC PTC TS PC MSL	JESD22-A104 JESD22-A105 JESD22-A106 JESD22-A113 J-STD-020	Open Functional Failure	Bond Ball Lift Ball Neck Open Stitch Bonding Open Gold Wire Broken Solder Bump Open Passivation Damaged Passivation Crack Delamination between layers in die(wafer) Delamination between package(mold compound) and die Delamination between package(mold compound) and internal layer Pad Cratering Aluminum Slide Failure Whisker
HTOL HTS	JESD22-A103 JESD22-A108	Open Leakage Functional Failure	Bond ball lift by Kirkendall effect Passivation Damage Stress Migration Mobile Ion Charge Charge Loss Aluminum Metal Corrosion Oxide Breakdown
LTOL LTS	JESD22-A108 JESD22-A119	Leakage Functional Failure	Gate Oxide Breakdown
BL Drop BL TC Bending	JESD22-B111 IPC9701 JESD22-B113	Open	Solder Joint Crack
ESD HBM ESD MM ESD CDM Latch-up	(Commercial) JS-001 JESD22-A115 JS-002 JESD78 (Automotive) AEC-Q100-002 AEC-Q100-003 AEC-Q100-011 AEC-Q100-004	Open Short Leakage	Contact Spike Gate Oxide Break Poly Melting Metal Melting
TDDB	JP001	Leakage Functional Failure	Gate Oxide Breakdown Oxide Breakdown

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